ULT TIMbber™

TIM 1.5 Thermal Interface Material for High Performance Computing

The ULT series of Arieca’s proprietary TIMbber™ technology combines extremely low thermal resistance (~2-10 mm²·K/W) with superior mechanical reliability.  

This formulation is specialized for High Performance Computing applications that utilize a large silicon die (>20mm x 20mm)

KEY FEATURES

  • Extremely low thermal resistance
  • High adhesion
  • Low BLT
  • Extreme elongation
  • High reliability (HTS, HAST, shock and vibration, pump out)
  • High operating temperature stability
  • Single component, thermally curable
  • Snap Cure compatible
  • Solvent free
  • Electrical isolation
  • Auger dispense compatible

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