SEMICONDUCTORS

The Elegant High Performance Thermal Solution

Solder-based metals are the premier thermal interface for semiconductor applications. However, it requires a large bond line and complicates assembly. Arieca’s LMEE brings thin bond line liquid metal TIM to standard HVM flows.

ALT Series - TIM1

Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.

ALT Series - TIM1.5

Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.

ALT Series - TIM2

Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.

Radically changing the way TIMs thermally connect layers.

Extremely low thermal resistance

Reliability through encapsulation

Excellent low temperature performance through microarchitecture optimizing

Gallium-based liquid metals crystalize at a relatively high temperature (-18C)

Base polymers maintain constant phase over a wide temperature range

LMEE maintains the base polymer thermal performance

Let's explore if Arieca's products are right for you.