SEMICONDUCTORS
Solder-based metals are the premier thermal interface for semiconductor applications. However, it requires a large bond line and complicates assembly. Arieca’s LMEE brings thin bond line liquid metal TIM to standard HVM flows.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Extremely low thermal resistance
Reliability through encapsulation
Excellent low temperature performance through microarchitecture optimizing
Gallium-based liquid metals crystalize at a relatively high temperature (-18C)
Base polymers maintain constant phase over a wide temperature range
LMEE maintains the base polymer thermal performance