The Elegant High Performance Thermal Solution

Modern microelectronics is approaching a heat wall. Arieca’s LMEE is a simple, high reliability, HVM compatible component to a superior thermal management solution.

ALT Series - TIM1

Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.

EXT Series - TIM1.5 & TIM2

Arieca’s EXT series targets external IC TIM2 applications, bringing high reliability metal-like thermal performance in an easy to dispense format.
The EXT series is a dielectric material, does not require high application pressure, and is easy to rework.

Radically changing the way TIMs thermally connect layers.

Contact resistance arising from particle-to-particle and particle-to-surface resistances is the major contributing factor for high interfacial contact resistance in traditional P-TIMs. Liquid Metal fillers dramatically change this. Additionally, highly deformable liquid filers allow extremely low bond-line thicknesses achievable.

Microstructure of Polymer-TIMs

Liquid metals as fillers dramatically change the way polymer-filled TIMs transfer heat between interfaces by establishing extremely low contact resistance enabling low bond-line thicknesses.


  • Exceptional Thermal Resistance
  • 1000 Cycles Thermal Shock per MIL-STD-883B
  • 500 Hours (Test continuing to 1000 hours) High Temperature Storage per JEDED 22-A103
  • 300 Hours (Test continuing to 1000 hours) HAST per JEDEC 22-A101

Let's explore if Arieca's products are right for you.