SEMICONDUCTORS
Traditional solder-based metals are commonly used in semiconductor applications. However, due to their rigidity and lack of conformance, they require a large bond line and complicated assembly. Arieca’s high elongation, conforming LMEE brings thin bond line liquid metal TIMs to standard HVM flows without sacrificing reliability.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistance and thin yet reliable bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickel-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment. ALT is a suitable replacement for Polymetric TIM (PTIM).
Arieca’s EFT series targets the TIM1.5 space, where multi-chip modules (MCM) are connected to the heat sink, achieving extremely low thermal resistance through the realization of low contact resistant and optimized bondline thicknesses. The EFT series is a cure-in-place emulsion that is reworkable. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s EXT series is an easy-to-use replacement of pure liquid metal for the TIM2 space, achieving extremely low thermal resistance (approaching liquid metals) for board level TIM applications. The EXT series is a non-curing emulsion that has been optimized for easy dispensing and rework with current high-volume manufacturing (HVM) methods.
The most important test for a TIM is the implementation and measurement of in-package thermal resistance with a Thermal Test Vehicle (TTV). Arieca uses a proprietary TTV to test thermal resistance at t0 and after reliability cycles. Our TTV has active die dimensions of ~11mm x 13mm, and includes a custom heater network and thermal diodes, simulating the conditions experienced by modern semiconductors.
per MIL-STD-883B:
Test area shall be at -55°C (-10°C, +0°C) and +125°C (+10°C , -0°C) for a minimum of 10 minutes
per JEDEC 22-A103 Condition A:
+125°C (-0°C, +10°C)
per JEDEC 22-A101:
85 ±2°C, 85 ±5%RH
The microdroplets of liquid metals inside TIMbber remain liquid during the whole thermal shock temperature cycles, allowing for extremely reliable interfaces.
