SEMICONDUCTORS
Solder-based metals are the premier thermal interface for semiconductor applications. However, it requires a large bond line and complicates assembly. Arieca’s LMEE brings thin bond line liquid metal TIM to standard HVM flows.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s EFT series targets the TIM1.5 space, where multi-chip modules (MCM) are connected to the heat sink, achieving extremely low thermal resistance through the realization of extremely low contact resistant for multiple thin bondline thicknesses. The EFT series is a cure-in-place emulsion that is reworkable. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s EXT series is an easy-to-use replacement of pure liquid metal for the TIM2 space, achieving extremely low thermal resistance (approaching liquid metals) for not highly controlled TIM2 applications. The EXT series is a non-curing emulsion that has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Arieca’s TIMbber architecture allows for extremely low thermal resistance. This is possible by having a single liquid metal microdroplet bridging the interfaces. This architecture reduces the contact resistances which is the dominate factor in most other TIMs. We used NanoTest TIMA to measure thermal resistance as a function of bond-line Thickness (BLT) and achieved less than 7 mm2.C/W.
The most important for test for a TIM is the implementation and measurement of in-package thermal resistance with a Thermal Test Vehicle (TTV). Arieca uses a proprietary TTV, with an active die dimensions of ~11mm x 13mm and heater network and thermal diodes to test thermal resistance at t0 and after reliability cycles
per MIL-STD-883B:
Test area shall at -55°C (-10°C, +0°C) and +125°C (+10°C , -0°C) for a minimum of 10 minutes
per JEDEC 22-A103 Condition A:
+125°C (-0°C, +10°C).
per JEDEC 22-A101:
85 ±2°C, 85 ±5%RH
The microdroplets of liquid metals inside TIMbber remain liquid during the whole thermal shock temperature cycles allowing for extremely reliable interfaces.
