SEMICONDUCTORS
Modern microelectronics is approaching a heat wall. Arieca’s LMEE is a simple, high reliability, HVM compatible component to a superior thermal management solution.
Arieca’s ALT series targets the TIM1 space, achieving extremely low thermal resistance through the realization of extremely low contact resistant and reliable thin bondline thicknesses. The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickle-plated copper. The emulsion has been optimized for easy dispensing with current high-volume manufacturing (HVM) equipment.
Contact resistance arising from particle-to-particle and particle-to-surface resistances is the major contributing factor for high interfacial contact resistance in traditional P-TIMs. Liquid Metal fillers dramatically change this. Additionally, highly deformable liquid filers allow extremely low bond-line thicknesses achievable.
Liquid metals as fillers dramatically change the way polymer-filled TIMs transfer heat between interfaces by establishing extremely low contact resistance enabling low bond-line thicknesses.
