Our Technology

New Paradigm in Thermal Interface Materials

Arieca is the pioneer in polymer-encapsulated liquid metal (LM) materials for thermal management.  Called Thubber™, these LM-polymer composites uniquely combine the high thermal conductivity of metals with the mechanical robustness of soft polymers.

TIMbber™ is a version of Thubber that is designed for applications in semiconductor cooling and heat dissipation.  These patented TIM technologies are engineered to minimize thermal contact resistance, maximize mechanical reliability, and be compatible with standardized high volume manufacturing techniques.   

Features

  • Combining high thermal and/or electrical conductivity with the mechanical properties of soft biological tissues
  • Reliably containing liquid metal inside a protective elastomer matrix
  • Tailoring properties for specific applications
  • Metal-like fracture toughness (10-30 kJ/m2) that is 25-50x greater than conventional silicone rubber
  • Maintaining performance under high deformation and mechanical damage
  • Direct ink printing

Let's invent the future