Arieca

ALT TIMbber™

TIM 1 Thermal Interface Material for Power Modules & Power Electronics

Arieca’s ALT series targets TIM 1 applications that require extremely low thermal resistance.  This is achieved with a unique liquid metal polymer architecture that enables a thin, yet reliable BLT.

The ALT series is a cure-in-place emulsion that has been optimized for adhesion to silicon and nickel-plated copper.

Download ALT Datasheet

KEY FEATURES

  • Low thermal resistance
  • Extremely high adhesion
  • Low BLT
  • Extreme elongation
  • High reliability (HTS, HAST, shock and vibration, pump out)
  • High operating temperature stability
  • Single component, thermally curable
  • Snap Cure compatible
  • Solvent free
  • Electrical isolation

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