We are excited to speak at the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference 2025 in Phoenix. Don’t miss your opportunity to learn how Arieca’s Liquid Metal Embedded Elastomer (LMEE) TIMs are revolutionizing semiconductor cooling!
To learn more about Arieca, please visit arieca.com or email partner@arieca.com
Media contact:
media@arieca.com