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Arieca Announces $6.5 Million Series A Funding Round

Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs).

(Pittsburgh, PA.) Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, today announced a $6.5 million Series A funding round co-led by Nissan Chemical Corporation and 412 Venture Fund, with participation from ROHM Co. Ltd., Monozukuri Ventures, Mountain State Capital, Innovation Works and Carnegie Mellon University.

“The semiconductor industry is facing an acute heat problem. Further progress in manufacturing of

Arieca's Team in Pittsburgh’s Headquarter. From left to right: Navid Kazem, Vivek Singh, Dylan Shah, Jeffrey Gelorme, Nolan Steeley, Allyssa Kerr

microprocessors with node sizes of 7nm, 4nm and even lower sizes in the roadmap require an acceleration in packaging technologies to compensate for the ever-growing heat densities in the next generation of devices. We, at Arieca, are developing Liquid Metal-based TIMs to give the designers the performance of liquid metals with the ease of manufacturing of thermal greases” said Dr. Navid Kazem, CEO and Co-Founder at Arieca.

“Arieca’s materials are very promising innovative solutions for the market that will grow significantly in the future. We hope to make a strong cooperative collaboration on top of the Investment in the Company” said Endo Hideyuki Managing Executive Officer, and Head of Planning and Development Division at Nissan Chemical. Ilana Diamond, the Managing Partner at 412 Venture Fund added that “we have followed Arieca’s progress since their formation and have been impressed by their progress attracting customers and partners in the semiconductor industry with a large market size. We are delighted to be partnering with a world class team to help them bring an innovative material solution to a growing market.”

About Arieca

Arieca is a high growth advanced materials start-up that is pushing the boundaries of material functionalities in the most demanding applications. Our patented Liquid Metal Embedded Elastomer (LMEE) technology allows for unprecedented performance in applications across the semiconductor, aerospace, automotive, and healthcare industries.  Our main products are TIMbberTM – an adaptable thermal interface material (TIM) for high performance semiconductor and power devices, and Thubber® – a soft, stretchable, and thermally conductive elastomer.  Arieca was spun off from Carnegie Mellon University in 2018.

About Nissan Chemical Corporation

Nissan Chemical Corporation is now moving forward to develop new products and business through utilization of our core technologies as the chemical company with our corporate vision of becoming a corporate group that “contribute to the protection of the global environment and the existence/ development of humanity, offering the value sought by society”. The Planning and Development Division’s mission is to create new products and businesses which are the pillars of our future in “information and communication”, “environment and energy” and “life sciences other than pharmaceuticals and agrochemicals”. While to clarify the characteristics of the new seeds with highly originality and capture the market needs, we are promoting the actual demand of new products that meet customer needs. For more details, please visit nissanchem.co.jp.

About 412 Venture Fund 

412 Venture Fund is an early-stage venture capital firm, created by founders, for founders. 412VF invests in technology enabled companies that can benefit from our partners’ diverse experience and network in business software solutions, deep tech, AI & ML, health tech, and Industry 4.0. For more information, visit 412venturefund.com.

To learn more about Arieca please email partner@arieca.com

Media contact:

media@arieca.com 

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Press Release

Arieca Announces an Agreement to Develop a Liquid-Metal-Based Thermal Interface Material for Power Modules in the Electric Vehicle (xEV) Segment

(Pittsburgh, PA.) Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to develop next-generation TIM using Arieca’s Liquid Metal Embedded Elastomer (LMEE) Technology. This joint research leverages the LMEE platform to provide high heat transfer without the reliability issues facing conventional TIM technologies.

“ROHM is a global leader in SiC power module technology,” Navid Kazem, Arieca’s CEO said. “Their SiC devices can significantly improve power delivery in xEV while reducing the size of power inverters. Arieca is excited to partner with such an innovative company to improve the performance of power module assembly in the xEV market.”

“We need an innovative thermal interface material between the power module and heat sink,” said Ken Nakahara, Fellow and Head of ROHM’s R&D Center. “The most important requirement is compatibility with sufficient thermal conductivity and reliability, which are usually in a trade-off relationship. Arieca’s LMEE has the possibility to satisfy this prerequisite, allowing us to innovate in the xEV market. As a result, we decided to start collaborative R&D with Arieca. “This joint research agreement provides ROHM with the latest TIM technologies required to successfully introduce next-generation SiC power modules for xEV applications.”

About Arieca

Arieca is a high growth advanced materials start-up that is pushing the boundaries of material functionalities in the most demanding applications. Our patented Liquid Metal Embedded Elastomer (LMEE) technology allows for unprecedented performance in applications across the semiconductor, aerospace, automotive, and healthcare industries.  Our main products are TIMbberTM – an adaptable thermal interface material (TIM) for high performance semiconductor and power devices, and Thubber® – a soft, stretchable, and thermally conductive elastomer.  Arieca is a spin-off from Carnegie Mellon University in 2018.

About ROHM

Founded in 1958, ROHM provides LSI and discrete semiconductors characterized by outstanding quality and reliability for a broad range of markets, including automotive, industrial and consumer market via its global development and sales network. In the power & analog field, ROHM proposes the suitable solution for each application with power devices such as SiC, driver ICs to maximize their performance, and peripheral components such as transistors, diodes and resistors.

Further information on ROHM can be found at www.rohm.com

To learn more about Arieca please email: partner@arieca.com

Media contact: 

media@arieca.com

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NBMC/AFRL News Press Release

Arieca Receives a grant from the Nano Bio-Materials Consortium (NBMC) to develop Self-Powered Wireless Soft Electronics with Multimodal Energy Harvesting

In this project we will address challenges with the limited battery life of wearable healthcare technologies for continuous physiological monitoring. We will develop self-powered wireless soft electronics that adhere to the skin and monitor physiological vitals.  These electronic stickers will be powered through a combination of on-board batteries and energy harvesting transducers. This project is in collaboration with Carnegie Mellon University, Prof. Carmel Majidi Soft Machines Lab, and Dr. Christopher Tabor at Air Force Research Lab (AFRL).

Energy harvesting will be achieved using thermoelectric and triboelectric power generation from body heat and motion, respectively. LMEE will be integrated into both generators – as

a thermal interface material for thermoelectric heat management and a dielectric elastomer and conductive electrode for triboelectric harvesting.  As part of this NBMC-sponsored effort, Arieca will also explore the use of LMEEs as electrically-conductive elastomers for stretchable circuit wiring and bioelectrodes.

For more information please reach out to partner@arieca.com

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NSF SBIR News Press Release

Arieca Receives an NSF Small Business Innovation & Research (SBIR) Grant to Develop Liquid Metal-Based Thermal Interface Materials (TIMs) Based on the Liquid Metal Embedded Elastomer (LMEE) Architecture

Thermal management issues in the semiconductor industry are driven by a sharp increase in power densities. To resolve these issues, many attempts are being investigated in device packaging to extract the heat generated away and maintain the functionality of the device. Existing thermal interface materials (TIMs) play an important role in transferring the heat efficiently but suffer from challenges associated with interfacial contact thermal resistance, optimized distribution of TIM over the die surface, pump-out and delamination.

This SBIR project supports Arieca’s efforts to create a TIM version of LMEEs, which we call TIMbberTM, to overcome these challenges. Specific efforts will focus on refining the formulation and fabrication to meet customer specifications. This includes improvement of the TIMbber material composition, development of a scalable manufacturing process, and characterization of materials properties for TIM applications.

For more information please reach out to partner@arieca.com

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Press Release Seed Round

ITIC Leads Seed-Round Investment in Arieca (A Carnegie Mellon University Spin-Off)

Pittsburgh, March 2019— The Industrial Technology Investment Corporation (ITIC) has invested in Arieca LLC, a Pittsburgh-based advanced materials start-up that is commercializing Thubber, a thermally conductive rubber with an exceptional combination of elastic and thermal properties.  ITIC is one of Taiwan’s oldest and most prestigious VC firms, and is leading Arieca’s seed round with an investment that will accelerate commercialization efforts in the automotive, semiconductor, and aerospace sectors.

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NASA SBIR News Press Release

Arieca Receives a NASA Small Business Innovation & Research (SBIR) Grant to Develop Space Grade Version of Liquid Metal Embedded Elastomers (LMEEs) for Applications in Aerospace Industry

Elastomers like silicone rubber have a central role in space technologies.  They are used as sealants, encapsulants, connectors — e.g. gaskets, O-rings, etc. — and diaphragms in propellant tanks, docking mechanisms, optical systems, and a wide range of other subsystems used in spacecraft.  Because of their ability to dissipate mechanical energy, elastomers can also be used for vibration mounts and shock absorbers. However, the poor thermal conductivity of existing elastomers can result in damaging hot spots from heat trapping or extreme internal stresses from mismatches in temperature and thermal expansion.  This can be especially problematic for applications in which elastomers are used to seal or encapsulate propulsion systems, electronic instrumentation, laser optics, and other heat-producing components and subsystems.

[Credit: NASA; public domain image]

In this SBIR project, Arieca will work with NASA to explore ways to use LMEEs to address these critical challenges in space technologies.  Specifically, the team will develops a “space grade” version of LMEEs that exhibits the following properties: (i)  negligible outgassing, (ii) withstand wide operational temperature range, (iii) Ability to survive cryogenic exposure and deep freeze storage, and (iv) resistance to embrittlement from irradiation.  Such materials would eliminate the need for additional heat management systems that would otherwise be required to ensure uniform temperature distribution and to prevent heat from getting trapped.

To learn more about Arieca’s Space Grade formulations, reach out to partner@arieca.com.