We create thermal interface materials (TIMs) for IC packaging and power modules. Our pioneering TIMbber formulations blend liquid metal and polymer to combine superior thermal performance with exceptional mechanical reliability.
Arieca’s pioneering discovery uniquely combines droplets of liquid metal (LM) alloy with soft polymers to create TIMs with exceptional thermal performance and mechanical reliability. Our breakthrough LM-polymer technology is engineered to be compatible with all stages of the semiconductor packaging workflow.
